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The 7200Plus is part of a family of wire bonders designed specifically for the semiconductor industry. Focusing on a specific market allowed us to engineer a new equipment platform meeting today’s semiconductor challenges to attain high productivity, process stability, low cost of ownership (COO) and the flexibility to grow with the market demands.

The pluses built into the 7200Plus are made possible through Orthodyne’s experience and understanding of changing customer needs. With a commitment to outstanding performance, exceptional customer service and ongoing product development, we’ve made a better bonder even better.

Cost of Ownership
• UPH: The low-mass bondhead and XY table design, in conjunction with high performance drives and advanced motion control technology, result the most productive bonder for power semiconductors.



• Single- and Multi-Head Configurations: The 7200Plus platform design provides maximum flexibility. Single- and Multi-head versions let you configure your production line with exactly the number of bondheads required to balance the production flow.



• High-Speed Programmable Indexer: 150 ms for a TO220 device. Users can store and recall parameters and indexer positions to reduce programming time and the calibration time.



• On-Board Diagnostics: Continuous feedback of major equipment functions results in higher uptime and controlled performance.



• Bondhead Design: Low-maintenance and low-mass bondhead design allows for the highest UPH, excellent process control and unmatched uptime.



• Enhanced PR System: The enhanced third generation system (GSIII) offers accuracy and repeatability through a variety of powerful tools for virtually every device.



• Pullout Clamp Station: Allows the user to have a second set of tooling readily available for quick product changeover and minimized downtime.


Uncompromised Quality
• Bond Process Monitoring: Optional system monitors bond deformation and ultrasonic signal in real-time. Suspect bonds are flagged and vital process information can be stored for evaluation.



• Active Loop Control (ALC) Bondhead: Available as Front or Rear Cut version, the bondhead design provides excellent loop control and non-destructive pulltest capability.



• Pulltesters: Up to 4 in-line transport pulltesters per bonder module provide expanded non-destructive pulltest and loop height check capability for standard and matrix leadframes.



• Multiple Bond Frequencies: Multiple bond frequency options are available. All bond frequencies are supported through OE proprietary digital generator technology.


Expandable Cutting Edge Capabilities
• Matrix Capabilities: The 7200Plus features full matrix capabilities for leadframes up to 72mm wide.



• Small Wire, Large Wire, PowerRibbon®: Each bonder module can be easily configured to large wire, small wire, or PowerRibbon® providing flexibility for a wide product spectrum.



• Networking: Simple networking via Ethernet. SECS/GEM is available as an option.



• Software: New GUI-based software structure offers simplified, user-friendly machine operation and sophisticated troubleshooting tools resulting in lower training cost and increased uptime.



• File Handling: A CDRW, hard drive, and networking capabilities provide easy-to-use tools for data transfer, data storage, and program back-up.



• Advanced Looping Algorithms: Constant loop length or height are just two of many looping features available.