Click image to view machine

With the 7200, Orthodyne introduces the first in a series of wire bonders designed specifically for the semiconductor industry. Focusing on a specific market allowed us to engineer a new equipment platform meeting today's semiconductor challenges to attain high productivity, process stability, low cost of ownership (COO) and the flexibility to grow with the market demands.

Cost of Ownership
• UPH: The low-mass bondhead and XY table design, in conjunction with high performance drives and advanced motion control technology, result in 20% to 50% higher UPH than previous Orthodyne models.



• Single- and Multi-Head Configurations: The 7200 platform design provides maximum flexibility. Single- and Multi-head versions let you configure your production line with exactly the number of bondheads required to balance the production flow.



• High Speed Indexer: The newly designed 7200 Indexer is considered one of the fastest in the market, offering index times of 150ms for a TO220 device.



• New Small & Large Wire Bondheads: Low-maintenance and low mass bondhead design allows for higher UPH and better process control.



• Programmable Indexer: Lets user store and recall parameters and indexer positions, minimizing programming and calibration for increased uptime.



• Enhanced PR System: The 7200 features fluorescent area lighting, new wide-angle coaxial light, and improved optics. The enhanced Orthodyne GSIIA PR system ensures accuracy and repeatability.



• Pullout Clamp Station: Allows the user to have a second set of tooling readily available for quick product changeover and minimized downtime.


Uncompromised Quality
• Process Monitoring: On-board diagnostics and expanded process statistics allow for simplified machine and process monitoring, resulting in high uptime and a high level of quality control.



• Improved Active Loop Control (ALC) Bondhead: New ALC bondhead design with improved clearance provides better loop control and non-destructive bondhead pulltest capability for virtually any device.



• Pulltesters: Up to 4 in-line pulltesters per bonder module provide expanded non-destructive pulltest and loop height check capability for standard and matrix leadframes.


Expandable Cutting Edge Capabilities
• Matrix Capabilities: The 7200 features full matrix capabilities for leadframes up to 72mm wide.



• Large-Small Wire Configurable: Both bonder modules can be easily configured to either large or small wire, providing maximum flexibility for a changing product spectrum.



• Networking: Simple networking via Ethernet, USB or serial port. SECS/GEM is available as an option.



• Software: New GUI-based software structure offers simplified, user-friendly machine operation and sophisticated troubleshooting tools resulting in lower training cost and increased uptime.



• File Handling: A CDRW, hard drive, and networking capabilities provide easy-to-use tools for data transfer, data storage, and program back-up.


Available Options
• Transport Pulltesters: The 7200 can be equipped with up to four in-line pulltesters per bonder module.



• Additional Small or Large Wire Kits: These kits provide full configuration flexibility and simple conversion from large to small wire.



• Additional clamp stations: Pre-setup for simple product changeover, additional clamp stations represent a powerful option to minimize machine downtime.



• SECS/GEM Interface: Optional factory automation protocol.