- Bonds to almost any electronic package
requiring 38-75 micron (1.5-3 mil) wire.
- Four-axis head allows bonding in any
direction, to any type of module, leadframe or hybrid substrate.
- Programmable bonding parameters for each
bond produce better bond quality and reliability.
- Available as a stand-alone machine, as part
of a large and small dual head bonder, or as a retrofit to an existing 360C
large wire bonder.
- Unique low maintenance bond head provides
soft touchdown combined with high resolution LVDT for controlled bond
placement.
- Motorized dereeler assembly and jewel
bearing wire feed mean better looping control, low maintenance, and high
uptime.
- Programmable lift-off angle and wire feed
minimize heel cracks.
- Modular and flexible design makes for easy
integration into automated lines and easy changeover between small and large
wire.
If you would like more information about our products,
please call us at (949) 660-0440, or contact us through our e-mail system:
sales@orthodyne.com |
