- Bonds to almost any electronic package
requiring 100-500 micron (4-20 mil) wire.
- Four-axis head allows bonding in any
direction, to any type of module, leadframe or hybrid substrate.
- Programmable bonding parameters for each
bond produce better bond quality and reliability.
- Programmable indexing and simplified tooling
for fast, simple and repeatable production changeovers.
- Enhanced process control features can be
individually modified for each bond.
- Orthodyne proprietary gray-scale pattern
recognition system gives higher yield and throughput rates.
- Low maintenance bond head with no pivot
bearing or solenoids to bind or wear.
- Enhanced diagnostics, statistics and wire
handling features for better process control.
- Sophisticated, menu driven software is easy
to program and modify.
- Options include non-destructive pull testing
with exclusive built-in loop height detector, and destructive pull test
mode.
If you would like more information about our products,
please call us at (949) 660-0440, or contact us through our e-mail system:
sales@orthodyne.com |
