Orthodyne Electronics is the leading manufacturer of ultrasonic wire bonders, with an established tradition of developing revolutionary products for the semiconductor and microelectronics industries.

Orthodyne is an organization that hires exceptional individuals for the long term, invests in their growth and development, and offers them a warm environment of shared goals and values, rich experiences and opportunities. We look for individuals whose talents and accomplishments will contribute to our thriving organization.

We are currently searching for an Applications Engineer, Intermediate to work in our Sales/Marketing Department.

DUTIES & RESPONSIBILITIES:

• The Applications Department Supervisor assigns Applications Work Orders (AWO) or special projects requested by sales managers from their respective sales territories to the AE.

• Develop test plans and execute experiments based on statistical principles to characterize or analyze process issues.

• Work closely with cross-functional teams in developing new products to meet new application requirements or new markets and define new product specifications.

• Support the Engineering and the Sales and Marketing Departments in the development and testing of new interconnect solutions or products for existing and emerging markets.

• Support customers in pre and post sales activities and design cycle activities, troubleshoot customer product design or process issues and provide recommendations based on results from experimentation.

• Provides technical, installation and training support to the customers or reps during new product or process introductions.

• Support customers in process troubleshooting.    

• Attends trade shows and product demonstrations; may occasionally lift and/or move up to 30 pounds.

• AE may be required to travel internationally to provide on-site technical support to customers typically up to 25% annually.

EXPERIENCE REQUIRED:

• Strong analytical and problem solving skills with the ability to summarize complex data set for technical and non-technical audiences. Ability to use statistical tools is a plus. 
• Ability to read mechanical drawings.
• Have good written and verbal communication skills.
• Must proficient in Microsoft Excel, Word and PowerPoint.
• Ability to work independently with self-direction and limited supervision.
• Must be organized, systematic, punctual, and goal-oriented.
• Must be able to use microscopes and/or operate M20, M360, or NGB wirebonders.

• Possess a Bachelor or Master of Science degree from an accredited four-year college or university in Materials Science, Physics, Mechanical, Electrical, or Chemical Engineering, or related field of study.

• Minimum 3 - 5 years process engineering experience in semiconductor packaging or hybrid microelectronics assembly or related field.