The incorporation of semiconductors into
a broad range of new technologies has changed how the world looks at virtually
every electronic product. From automobiles with computer controlled engine
modules to computers, stereos, and home appliances, "the chip" is
everywhere. It is in this ever expanding, competitive marketplace that
Orthodyne robotic bonding machines are being asked to speed manufacturing and
improve quality.
Our technology
By itself, a semiconductor chip can't
perform. It needs to be connected to a circuit, and wire bonding makes this
connection. Reliable, flexible in the number of wires and connection points,
wire bonding is easy to automate and cost effective. Orthodyne has perfected
the process through ultrasonics, where a high frequency vibration bonds the
wires at the appropriate and precise locations required. We design high speed,
robotic, four-axis equipment that fits into factory automation and handling
systems.
When you combine robotic control of
four-axis work tables and highly precise vision control systems to locate parts
in exacting locations, a daily 24 hour manufacturing schedule and thousands of
bonds per hour, a seemingly simple task becomes a complex challenge.
Our products
Today, Orthodyne is known for our reliable, hard-working robotic model
3600Plus for hybrid power modules, the manual Model 20 for process
development or low volume production, and our 7200Plus, a dual-head
machine for semiconductor applications requiring two different wire sizes.
